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NTB5860N, NTP5860N,
NVB5860N
N-Channel Power MOSFET
60 V, 220 A, 3.0 m W
Features
? Low R DS(on)
? High Current Capability
? 100% Avalanche Tested
? These Devices are Pb ? Free, Halogen Free and are RoHS Compliant
? NVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
V (BR)DSS
60 V
http://onsemi.com
R DS(on) MAX
3.0 m W @ 10 V
D
I D MAX
220 A
Qualified and PPAP Capable
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
G
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
V DSS
V GS
60
$ 20
V
V
S
N ? CHANNEL MOSFET
Continuous Drain
Current, R q JC
Power Dissipation,
R q JC
Steady
State
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
I D
P D
220
156
283
A
W
4
1
2
4
Pulsed Drain Current
t p = 10 m s
I DM
660
A
3
Current Limited by Package
I DMmax
130
A
TO ? 220AB
D 2 PAK
Operating and Storage Temperature Range
T J , T stg
? 55 to
+175
° C
1
2
3
CASE 221A
STYLE 5
CASE 418B
STYLE 2
Source Current (Body Diode)
I S
130
A
MARKING DIAGRAMS
Single Pulse Drain ? to ? Source Avalanche
Energy (L = 0.3 mH)
Lead Temperature for Soldering
Purposes (1/8 ″ from Case for 10 Seconds)
E AS
T L
735
260
mJ
° C
4
Drain
& PIN ASSIGNMENTS
4
Drain
THERMAL RESISTANCE RATINGS
NTB
Parameter
Junction ? to ? Case (Drain) Steady State
Symbol
R q JC
Max
0.53
Unit
° C/W
NTP
5860NG
AYWW
5860NG
AYWW
3
1
Source
Gate
Junction ? to ? Ambient ? Steady State (Note 1) R q JA 28
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
1
Gate
2
Drain
2
Drain
G = Pb ? Free Device
A = Assembly Location*
3
Source
Y = Year
WW = Work Week
*Could be one or two digit alpha or numeric code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
September, 2012 ? Rev. 2
1
Publication Order Number:
NTB5860N/D
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